Opportunity
Job Description
The Electronics Design and Analysis Engineer will serve as a subject-matter expert within Boeing’s Electronics Packaging and Product Design team. The engineer will develop packaging solutions for advanced electronic assemblies, multichip modules and microelectronics used in demanding aerospace environments. The position combines mechanical design, thermal management, structural analysis, materials selection, producibility and electronic-hardware integration.
Responsibilities
• Develop mechanical packaging for aerospace electronic assemblies.
• Design housings, card guides, thermal interfaces and component-support structures.
• Support multichip modules, microelectronics and circuit-card assemblies.
• Perform thermal and structural trade studies.
• Select materials, manufacturing methods and joining processes.
• Evaluate designs for vibration, shock, thermal cycling and environmental requirements.
• Coordinate with electrical, PCB, manufacturing, analysis and supplier teams.
• Lead design reviews and resolve packaging-related technical problems.
• Support prototype fabrication, testing and production transition.
• Establish packaging standards and mentor other engineers.
Eligibility
• Bachelor of Science degree in Engineering, Engineering Technology or another directly relevant technical discipline.
• Extensive experience designing and analysing electronic packaging or mechanical electronic products.
• Ability to meet United States export-control requirements.
• Ability to obtain a United States Secret security clearance.
• United States citizenship is required for the security clearance.
• Employer will not provide employment-visa sponsorship.
Required Skills
Preferred Skills
Application Instructions
Apply through Boeing’s official careers page and describe relevant electronic-packaging, thermal, structural and aerospace-hardware experience.
Apply through UCO Aero
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